Electronic assembly fabrication : chips, circuit boards, packages, and components /
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| 其他作者: | |
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| 格式: | 图书 |
| 语言: | 英语 |
| 出版: |
New York :
McGraw-Hill,
c2002.
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| 版: | 1st ed. |
| 丛编: | McGraw-Hill professional engineering
Electronic packaging and interconnection series |
| 主题: | |
| 在线阅读: | Contributor biographical information Publisher description Table of contents |
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