Electronic assembly fabrication : chips, circuit boards, packages, and components /
Bewaard in:
| Andere auteurs: | |
|---|---|
| Formaat: | Boek |
| Taal: | Engels |
| Gepubliceerd in: |
New York :
McGraw-Hill,
c2002.
|
| Editie: | 1st ed. |
| Reeks: | McGraw-Hill professional engineering
Electronic packaging and interconnection series |
| Onderwerpen: | |
| Online toegang: | Contributor biographical information Publisher description Table of contents |
| Tags: |
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