Electronic assembly fabrication : chips, circuit boards, packages, and components /

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Bibliografski detalji
Daljnji autori: Harper, Charles A. (Urednik)
Format: Knjiga
Jezik:engleski
Izdano: New York : McGraw-Hill, c2002.
Izdanje:1st ed.
Serija:McGraw-Hill professional engineering
Electronic packaging and interconnection series
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Online pristup:Contributor biographical information
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