Electronic assembly fabrication : chips, circuit boards, packages, and components /

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Bibliographic Details
Other Authors:	Harper, Charles A. (Editor)
Format:	Book
Language:	English
Published:	New York : McGraw-Hill, c2002.
Edition:	1st ed.
Series:	McGraw-Hill professional engineering Electronic packaging and interconnection series
Subjects:	Electronic apparatus and appliances > Design and construction.
Online Access:	Contributor biographical information Publisher description Table of contents
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