Electronic assembly fabrication : chips, circuit boards, packages, and components /

Shranjeno v:
Bibliografske podrobnosti
Drugi avtorji: Harper, Charles A. (Editor)
Format: Knjiga
Jezik:angleščina
Izdano: New York : McGraw-Hill, c2002.
Izdaja:1st ed.
Serija:McGraw-Hill professional engineering
Electronic packaging and interconnection series
Teme:
Online dostop:Contributor biographical information
Publisher description
Table of contents
Oznake: Označite
Brez oznak, prvi označite!

Podobne knjige/članki: Electronic assembly fabrication :