Electronic assembly fabrication : chips, circuit boards, packages, and components /
Gardado en:
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| Formato: | Libro |
| Idioma: | inglés |
| Publicado: |
New York :
McGraw-Hill,
c2002.
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| Edición: | 1st ed. |
| Series: | McGraw-Hill professional engineering
Electronic packaging and interconnection series |
| Subjects: | |
| Acceso en liña: | Contributor biographical information Publisher description Table of contents |
| Tags: |
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| Descrición Física: | xv, 672 p. : ill. ; 24 cm. |
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| Bibliografía: | Includes bibliographical references and index. |
| ISBN: | 0071378820 (alk. paper) |