Electronic assembly fabrication : chips, circuit boards, packages, and components /
Wedi'i Gadw mewn:
| Awduron Eraill: | |
|---|---|
| Fformat: | Llyfr |
| Iaith: | Saesneg |
| Cyhoeddwyd: |
New York :
McGraw-Hill,
c2002.
|
| Rhifyn: | 1st ed. |
| Cyfres: | McGraw-Hill professional engineering
Electronic packaging and interconnection series |
| Pynciau: | |
| Mynediad Ar-lein: | Contributor biographical information Publisher description Table of contents |
| Tagiau: |
Dim Tagiau, Byddwch y cyntaf i dagio'r cofnod hwn!
|
| Disgrifiad Corfforoll: | xv, 672 p. : ill. ; 24 cm. |
|---|---|
| Llyfryddiaeth: | Includes bibliographical references and index. |
| ISBN: | 0071378820 (alk. paper) |