Electronic assembly fabrication : chips, circuit boards, packages, and components /
Gorde:
| Beste egile batzuk: | |
|---|---|
| Formatua: | Liburua |
| Hizkuntza: | ingelesa |
| Argitaratua: |
New York :
McGraw-Hill,
c2002.
|
| Edizioa: | 1st ed. |
| Saila: | McGraw-Hill professional engineering
Electronic packaging and interconnection series |
| Gaiak: | |
| Sarrera elektronikoa: | Contributor biographical information Publisher description Table of contents |
| Etiketak: |
Etiketarik gabe, Izan zaitez lehena erregistro honi etiketa jartzen!
|
| Deskribapen fisikoa: | xv, 672 p. : ill. ; 24 cm. |
|---|---|
| Bibliografia: | Includes bibliographical references and index. |
| ISBN: | 0071378820 (alk. paper) |