Electronic assembly fabrication : chips, circuit boards, packages, and components /
Gardado en:
| Outros autores: | |
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| Formato: | Libro |
| Idioma: | inglés |
| Publicado: |
New York :
McGraw-Hill,
c2002.
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| Edición: | 1st ed. |
| Series: | McGraw-Hill professional engineering
Electronic packaging and interconnection series |
| Subjects: | |
| Acceso en liña: | Contributor biographical information Publisher description Table of contents |
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