Electronic Materials Innovations and Reliability in Advanced Memory Packaging
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| Autore principale: | |
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| Altri autori: | |
| Natura: | eBook |
| Lingua: | inglese |
| Pubblicazione: |
Springer Nature,
2025.
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| Soggetti: | |
| Accesso online: | Access eBook |
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| LEADER | 00000nam a2200000 a 4500 | ||
|---|---|---|---|
| 001 | 15922 | ||
| 005 | 20261004180910.0 | ||
| 008 | 261004s2025 o 000 eng | ||
| 020 | |a 978-3-031-94795-7 | ||
| 100 | 1 | |a Gan, Chong Leong |9 34182 | |
| 700 | 1 | |a Huang, Chen Yu |9 34183 | |
| 245 | 0 | 0 | |a Electronic Materials Innovations and Reliability in Advanced Memory Packaging |
| 260 | |b Springer Nature, |c 2025. | ||
| 300 | |a 1 online resource | ||
| 650 | 4 | |a Chemistry and Materials Science | |
| 538 | |a Mode of access: World Wide Web. | ||
| 856 | 4 | 0 | |u https://library.mist.ac.bd/ebooks/2793/go?src=vufind |z Access eBook |
| 942 | |c EBOOK | ||
| 999 | |c 15922 |d 15922 | ||