APA(7版)引用形式
Gan, C. L., & Huang, C. Y. (2025). Electronic Materials Innovations and Reliability in Advanced Memory Packaging. Springer Nature.
Chicagoスタイル(17版)引用形式
Gan, Chong Leong, , Chen Yu Huang. Electronic Materials Innovations and Reliability in Advanced Memory Packaging. Springer Nature, 2025.
MLA(9版)引用形式
Gan, Chong Leong, , Chen Yu Huang. Electronic Materials Innovations and Reliability in Advanced Memory Packaging. Springer Nature, 2025.
警告: この引用は必ずしも正確ではありません.