Electronic assembly fabrication : chips, circuit boards, packages, and components /
Enregistré dans:
| Autres auteurs: | |
|---|---|
| Format: | Livre |
| Langue: | anglais |
| Publié: |
New York :
McGraw-Hill,
c2002.
|
| Édition: | 1st ed. |
| Collection: | McGraw-Hill professional engineering
Electronic packaging and interconnection series |
| Sujets: | |
| Accès en ligne: | Contributor biographical information Publisher description Table of contents |
| Tags: |
Pas de tags, Soyez le premier à ajouter un tag!
|
| Description matérielle: | xv, 672 p. : ill. ; 24 cm. |
|---|---|
| Bibliographie: | Includes bibliographical references and index. |
| ISBN: | 0071378820 (alk. paper) |