Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces - High Performance Compute and System-in-Package (1st Edition)
Guardado en:
| Autor principal: | |
|---|---|
| Formato: | eBook |
| Lenguaje: | inglés |
| Publicado: |
Wiley,
2022.
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| Materias: | |
| Acceso en línea: | Access eBook |
| Etiquetas: |
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MARC
| LEADER | 00000nam a2200000 a 4500 | ||
|---|---|---|---|
| 001 | 28817 | ||
| 005 | 20261004184012.0 | ||
| 008 | 261004s2022 o 000 eng | ||
| 020 | |a 9781119793908 | ||
| 100 | 1 | |a Keser, Beth |9 57581 | |
| 245 | 0 | 0 | |a Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces - High Performance Compute and System-in-Package (1st Edition) |
| 260 | |b Wiley, |c 2022. | ||
| 300 | |a 1 online resource | ||
| 650 | 4 | |a Science & Technology | |
| 538 | |a Mode of access: World Wide Web. | ||
| 856 | 4 | 0 | |u https://library.mist.ac.bd/ebooks/14688/go?src=vufind |z Access eBook |
| 942 | |c EBOOK | ||
| 999 | |c 28817 |d 28817 | ||