Keser, B. (2022). Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces - High Performance Compute and System-in-Package (1st Edition). Wiley.
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Chicago Style (17th ed.) Citation
Keser, Beth. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces - High Performance Compute and System-in-Package (1st Edition). Wiley, 2022.
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MLA (9th ed.) Citation
Keser, Beth. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces - High Performance Compute and System-in-Package (1st Edition). Wiley, 2022.
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Warning: These citations may not always be 100% accurate.