Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
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| Main Author: | |
|---|---|
| Format: | eBook |
| Language: | English |
| Published: |
Springer Nature,
2024.
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| Subjects: | |
| Online Access: | Access eBook |
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| LEADER | 00000nam a2200000 a 4500 | ||
|---|---|---|---|
| 001 | 23703 | ||
| 005 | 20261004182827.0 | ||
| 008 | 261004s2024 o 000 eng | ||
| 020 | |a 978-981-97-2140-5 | ||
| 100 | 1 | |a Lau, John H. |9 48111 | |
| 245 | 0 | 0 | |a Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology |
| 260 | |b Springer Nature, |c 2024. | ||
| 300 | |a 1 online resource | ||
| 650 | 4 | |a Engineering | |
| 538 | |a Mode of access: World Wide Web. | ||
| 856 | 4 | 0 | |u https://library.mist.ac.bd/ebooks/9974/go?src=vufind |z Access eBook |
| 942 | |c EBOOK | ||
| 999 | |c 23703 |d 23703 | ||