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Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Engineering Springer Nature

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

John Lau, Xuejun Fan
Publisher
Springer Nature
Imprint
Springer
Year
2025
ISBN
978-981-96-4166-6
Category
Engineering
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